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Agenda: Europe (Amsterdam) Day 1 - OIP Forum

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Join the Ecosystem Pavilion and reach approximately 300 of director level and above executives from our customers!!

 Date: 05 / 27 / 2019

TimePlenary Session
10:30 - 11:00Registration Opens & Ecosystem Pavilion
11:00 - 11:05Opening Video
11:05 - 11:15Welcome Remarks
11:15 - 11:45Keynote – TSMC and Its Ecosystem for Innovation
11:45 - 12:15Partner Feature Talk – Partner CEO
12:15 - 13:15Lunch & Ecosystem Pavilion
Time Solutions in Automotive, Connectivity And IoT (ULP)
13:15 - 13:45Challenges in Implementing Complex Automotive SoCs with Advanced Technology Node
ST / Cadence Design Systems, Inc.
13:45 - 14:15Reliable and Flexible OTP Solutions in tsmc for Automotive, IoT and AI Applications
eMemory Technology Inc.
14:15 - 14:45The Benefits of Embedded In-Chip Monitoring on TSMC FinFET Processes for Data Centre and AI Chip Design
Moortec Semiconductor Ltd / Moortec Semiconductor Ltd
14:45 - 15:15Graphcore: designing next generation AI chips with Synopsys
Synopsys / Graphcore
15:15 - 15:30Coffee Break & Ecosystem Pavilion
15:30 - 16:00Silicon Solutions for HBM, CoWoS, InFO to Enable 112Gbps Interconnects in AI and HPC Applications
16:00 - 16:30Enabling Artificial Intelligence at the edge with Energy Efficient IPs Platform
Dolphin Integration
16:30 - 17:00Design and Verification of a 2.5GSps 10bit 9.41mW ADC in 16nm for Mobile Terminals
Huawei Technologies Sweden AB / Mentor, a Siemens Business
17:00 - 17:30Andes RISC-V CPU IP Provide Synergism for TSMC Process Portfolio
Andes Technology Corp
17:30 - 18:30Social Hour
Legal Notice
TSMC is not responsible for the content, accuracy, or reliability of any of the presentations at the TSMC Open Innovation Platform Ecosystem Forum. Furthermore, posting the presentation abstracts on TSMC's corporate website does not constitute an endorsement of the content of those presentations by TSMC. Any liability arising from the contents of any of the presentations is the responsibility of the presenter itself, and not TSMC.